Solder paste
   
Sn-Ag-Cu Series alloys
Lead-free and non-cleaning solder paste  
     
 

Based on the technology platform of Europe, America and Japan, fully independent research and development

 

Innovative R&D capabilities match the growing SMT process requirements

 

New rosin resin composite antioxidant technology, stable performance, moderate adhesion


 
     
Lead-free cleaning solder paste series
Model
FS-808A
FS-808C
FS-808T
FS-808S
Alloy composition
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Sn99Ag0.3Cu0.7
Sn99Ag0.3Cu0.7
Halogen


Halogen free


Halogen free
Powder granularity
Type3 25-45um
Type4 20-38um
Type3 25-45um
Type4 20-38um
Type3 25-45um
Type4 20-38um
Type3 25-45um
Type4 20-38um
Application

Air conditioning, refrigerators, vacuum cleaners, clocks and watches, computers, mobile phones, telecommunications equipment, TV sets, DVD, set-top boxes, lighting equipment, electric tools, toys, medical equipment, monitoring equipment, high-frequency head and other products covering circuit board welding.

 
 
   
Remarks
     
 

Good wettability, anti-drying time up to 48 hours, can more effectively maintain the paste product.

 

It has good rolling property and demoulding property. It can print PCB boards with spacing above 0.3 mm well, and the viscosity change is very little during continuous printing.

 

The solder joints are smooth, full and bright.

 

Lead-free solders with other special components should be consulted by our company.

 

The above product specifications, parameters and testing standards are subject to change without prior notice. Please refer to the product specifications issued by our company.

 
     
 
Production and Sales Centers in Mainland China
Hong Kong Regional Sales Centre
Suzhou Costar Electronic Materials Co., Ltd.
Hong Kong Costar Industrial Co., Ltd.
Zhuhai Costar Electronic Materials Co., Ltd.