SMT red glue
   
FD-6000 Series
SMT red glue  
     
 

The product FD-6011 is a one-component epoxy adhesive which cures rapidly after heating. Its shear thinning viscosity and low hygroscopicity make it very suitable for high-speed SMT screen printing and coating, and has a good controllable glue point shape.

 

The product FD-6021 (SMT) is a one-component epoxy adhesive which cures rapidly after heating. Its excellent thixotropic properties and air-free state make it very suitable for dispensing in high-speed SMT mounting machine, and it has good shape control of the dispensing point.

 



Typical uses

The product can be used to bond the patch elements to PCB before wave soldering. The low hygroscopicity of FD-6011 enables it to be exposed to open storage tanks for a long time without affecting the coating performance or causing holes in cured adhesives.

 

FD-6021SMTEspecially suitable for medium and high speed dispensing, high glue shape, high strength, good electrical performance occasions.

 

 
     

 
 
   
Remarks
     
 

Typical curing properties:

The optimum curing condition is to heat at temperatures above 100 C (generally at 150 C for 90 - 120 seconds, excluding heating time).

 

 The curing rate and ultimate strength depend on the retention time at curing temperature.

 

The above product specifications, parameters and testing standards are subject to change without prior notice. Please refer to the product specifications issued by our company

 
     
 
Production and Sales Centers in Mainland China
Hong Kong Regional Sales Centre
Suzhou Costar Electronic Materials Co., Ltd.
Hong Kong Costar Industrial Co., Ltd.
Zhuhai Costar Electronic Materials Co., Ltd.