Potting adhesive
   
FD502-H1/H2
Additive forming pouring sealant  
     
   
     

Additive Forming Pouring Sealant

Model

FD502-H1

FD502-H2

Weight ratio

1:1

1:1

Product description

Room temperature curing, heating can accelerate curing; good dielectric and flame retardant properties

Colorless Transparent Rapid Curing

Application

The encapsulation of LED driving power supply; the encapsulation of junction box of photovoltaic module

Encapsulation in the electronics industry

 
 
   
Remarks
     
 

The above product specifications, parameters and testing standards are subject to change without prior notice. Please refer to the product specifications issued by our company.

 
     
 
Production and Sales Centers in Mainland China
Hong Kong Regional Sales Centre
Suzhou Costar Electronic Materials Co., Ltd.
Hong Kong Costar Industrial Co., Ltd.
Zhuhai Costar Electronic Materials Co., Ltd.