Potting adhesive
   
FD502-H3/H4/H4L
Condensed pouring sealant  
     
   
     

Condensed pouring sealant

Model

FD502-H3

 FD502-H4

FD502-H4L

Weight ratio

10:1

 10:1

10:1

Product description

Grey, low viscosity, good leveling; cured to form a high strength rubber, impact resistance, thermal conductivity, flame retardant; excellent heat resistance, moisture resistance, cold resistance

Low viscosity, good leveling, suitable for complex electronic parts moulding; after curing to form a soft rubber shape, good impact resistance

Black, low viscosity, good leveling, excellent heat resistance, moisture resistance and cold resistance, can extend the life of electronic accessories after application.

Application

Power modules and electronic components need to be sealed in depth; thermal conductivity and flame retardant electronic components need to be sealed.

Filling of high-grade indoor and outdoor LED display

Power modules and electronic components need to be sealed in depth; moisture-proof, shock-proof, sealing and thermal conductive electronic components need to be sealed.

 
 
   
Remarks
     
 

The above product specifications, parameters and testing standards are subject to change without prior notice. Please refer to the product specifications issued by our company.

 
     
 
Production and Sales Centers in Mainland China
Hong Kong Regional Sales Centre
Suzhou Costar Electronic Materials Co., Ltd.
Hong Kong Costar Industrial Co., Ltd.
Zhuhai Costar Electronic Materials Co., Ltd.