Heat Conduction Material
   
FD502-H3/H4L
Thermal conductive sealant  
     
   
     

Thermal conductive sealant

Model

FD502-H3

FD502-H4L
Colour

gray

black

Product description

10:1 The thermal conductivity of organosilicon sealant is more than or equal to 0.6.

10:1 organic silicone sealant, thermal conductivity (> 0.6)

Application

Deep encapsulation of power modules and electronic components;Encapsulation of thermally conductive and flame retardant electronic components.

Deep encapsulation of power modules and electronic components;Encapsulation of moisture-proof, shock-proof, sealed, thermally conductive electronic components.

 
 
   
Remarks
     
 

The above product specifications, parameters and testing standards are subject to change without prior notice. Please refer to the product specifications issued by our company.

 
     
 
Production and Sales Centers in Mainland China
Hong Kong Regional Sales Centre
Suzhou Costar Electronic Materials Co., Ltd.
Hong Kong Costar Industrial Co., Ltd.
Zhuhai Costar Electronic Materials Co., Ltd.