Product description | Thermal conductivity 1.0,low oil separation150℃下Stable work | Thermal conductivity 2.0, lowoil separation,stable operationat 150 C | Thermal conductivity 3.0,low oil separation, stable operation at 150 C | Thermal conductivity 4.5, low oil separation, stable operation at 150 C |
Main application | Filling of Thermal Interface between Heat Dissipating Element and Base Plate | Filling of Thermal Interface between Heat Dissipating Element and Base Plate | Filling of Thermal Interface between Heat Dissipating Element and Base Plate | Filling of Thermal Interface between Heat Dissipating Element and Base Plate |
